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    首頁 » 翻譯詞匯 » 印制電路翻譯詞匯
    
                
            	
                
    
                
                
    印制電路翻譯詞匯
    
                    
                	
    導(dǎo)線：conductor trace line
    

    齊平導(dǎo)線：flush conductor
    

    傳輸線：transmission line
    

    跨交：crossover
    

    板邊插頭：edge-board contact
    

    增強(qiáng)板：stiffener
    

    基底：substrate
    

    基板面：real estate
    

    導(dǎo)線面：conductor side
    

    元件面：component side
    

    焊接面：solder side
    

    印制：print
    

    網(wǎng)格：grid
    

    圖形：pattern
    

    導(dǎo)電圖形：conductive pattern
    

    非導(dǎo)電圖形：non-conductive pattern
    

    字符：legend
    

    標(biāo)志：mark
    

    基材：base material
    

    層壓板：laminate
    

    撓性印制電路：flexible printed circuit (FPC)
    

    撓性印制線路：flexible printed wiring
    

    剛性印制板：flex-rigid printed board, rigid-flex printed board
    

    剛性雙面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
    

    剛性多層印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
    

    齊平印制板：flush printed board
    

    金屬芯印制板：metal core printed board
    

    金屬基印制板：metal base printed board
    

    多重布線印制板：multi-wiring printed board
    

    陶瓷印制板：ceramic substrate printed board
    

    導(dǎo)電膠印制板：electro conductive paste printed board
    

    模塑電路板：molded circuit board
    

    模壓印制板：stamped printed wiring board
    

    順序?qū)訅憾鄬佑≈瓢澹簊equentially-laminated multilayer
    

    散線印制板：discrete wiring board
    

    微線印制板：micro wire board
    

    積層印制板：build-up printed board
    

    積層多層印制板：build-up multilayer printed board (BUM)
    

    積層撓印制板：build-up flexible printed board
    

    表面層合電路板：surface laminar circuit (SLC)
    

    埋入凸塊連印制板：B2it printed board
    

    多層膜基板：multi-layered film substrate(MFS)
    

    層間全內(nèi)導(dǎo)通多層印制板：ALIVH multilayer printed board
    

    載芯片板：chip on board (COB)
    

    印制電路：printed circuit
    

    印制線路：printed wiring
    

    印制板：printed board
    

    印制板電路：printed circuit board (PCB)
    

    印制線路板：printed wiring board(PWB)
    

    印制元件：printed component
    

    印制接點：printed contact
    

    印制板裝配：printed board assembly
    

    板：board
    

    單面印制板：single-sided printed board(SSB)
    

    雙面印制板：double-sided printed board(DSB)
    

    多層印制板：multilayer printed board(MLB)
    

    多層印制電路板：multilayer printed circuit board
    

    多層印制線路板：multilayer printed wiring board
    

    剛性印制板：rigid printed board
    

    剛性單面印制板：rigid single-sided printed board
    

    剛性雙面印制板：rigid double-sided printed board
    

    剛性多層印制板：rigid multilayer printed board
    

    撓性多層印制板：flexible multilayer printed board
    

    撓性印制板：flexible printed board
    

    撓性單面印制板：flexible single-sided printed board
    

    撓性雙面印制板：flexible double-sided printed board
    

    埋電阻板：buried resistance board
    

    母板：mother board
    

    子板：daughter board
    

    背板：backplane
    

    裸板：bare board
    

    鍵盤板夾心板：copper-invar-copper board
    

    動態(tài)撓性板：dynamic flex board
    

    靜態(tài)撓性板：static flex board
    

    可斷拼板：break-away panel
    

    電纜：cable
    

    撓性扁平電纜：flexible flat cable (FFC)
    

    薄膜開關(guān)：membrane switch
    

    混合電路：hybrid circuit
    

    厚膜：thick film
    

    厚膜電路：thick film circuit
    

    薄膜：thin film
    

    薄膜混合電路：thin film hybrid circuit
    

    互連：interconnection
    

    覆金屬箔基材：metal-clad bade material
    

    覆銅箔層壓板：copper-clad laminate (CCL)
    

    單面覆銅箔層壓板：single-sided copper-clad laminate
    

    雙面覆銅箔層壓板：double-sided copper-clad laminate
    

    復(fù)合層壓板：composite laminate
    

    薄層壓板：thin laminate
    

    金屬芯覆銅箔層壓板：metal core copper-clad laminate
    

    金屬基覆銅層壓板：metal base copper-clad laminate
    

    撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film
    

    基體材料：basis material
    

    預(yù)浸材料：prepreg
    

    粘結(jié)片：bonding sheet
    

    預(yù)浸粘結(jié)片：pre-impregnated bonding sheer
    

    環(huán)氧玻璃基板：epoxy glass substrate
    

    加成法用層壓板：laminate for additive process
    

    預(yù)制內(nèi)層覆箔板：mass lamination panel
    

    內(nèi)層芯板：core material
    

    催化板材：catalyzed board ,coated catalyzed laminate
    

    涂膠催化層壓板：adhesive-coated catalyzed laminate
    

    涂膠無催層壓板：adhesive-coated uncatalyzed laminate
    

    粘結(jié)層：bonding layer
    

    粘結(jié)膜：film adhesive
    

    涂膠粘劑絕緣薄膜：adhesive coated dielectric film
    

    無支撐膠粘劑膜：unsupported adhesive film
    

    覆蓋層：cover layer (cover lay)
    

    增強(qiáng)板材：stiffener material
    

    銅箔面：copper-clad surface
    

    去銅箔面：foil removal surface
    

    層壓板面：unclad laminate surface
    

    基膜面：base film surface
    

    膠粘劑面：adhesive face
    

    原始光潔面：plate finish
    

    粗面：matt finish
    

    縱向：length wise direction
    

    模向：cross wise direction
    

    剪切板：cut to size panel
    

    酚醛紙質(zhì)覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
    

    環(huán)氧紙質(zhì)覆銅箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
    

    環(huán)氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates
    

    環(huán)氧玻璃布紙復(fù)合覆銅箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
    

    環(huán)氧玻璃布玻璃纖維復(fù)合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates
    

    聚酯玻璃布覆銅箔板：polyester woven glass fabric copper-clad laminates
    

    聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates
    

    雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad laminates
    

    環(huán)氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates
    

    聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates
    

    超薄型層壓板：ultra thin laminate
    

    陶瓷基覆銅箔板：ceramics base copper-clad laminates
    

    紫外線阻擋型覆銅箔板：UV blocking copper-clad laminates
    

    基材的材料
    

    A階樹脂：A-stage resin
    

    B階樹脂：B-stage resin
    

    C階樹脂：C-stage resin
    

    環(huán)氧樹脂：epoxy resin
    

    酚醛樹脂：phenolic resin
    

    聚酯樹脂：polyester resin
    

    聚酰亞胺樹脂：polyimide resin
    

    雙馬來酰亞胺三嗪樹脂：bismaleimide-triazine resin
    

    丙烯酸樹脂：acrylic resin
    

    三聚氰胺甲醛樹脂：melamine formaldehyde resin
    

    多官能環(huán)氧樹脂：polyfunctional epoxy resin
    

    溴化環(huán)氧樹脂：brominated epoxy resin
    

    環(huán)氧酚醛：epoxy novolac
    

    氟樹脂：fluorin resin
    

    硅樹脂：silicone resin
    

    硅烷：silane
    

    聚合物：polymer
    

    無定形聚合物：amorphous polymer
    

    結(jié)晶現(xiàn)象：crystalline polymer
    

    雙晶現(xiàn)象：dimorphism
    

    共聚物：copolymer
    

    合成樹脂：synthetic
    

    熱固性樹脂：thermosetting resin
    

    熱塑性樹脂：thermoplastic resin
    

    感光性樹脂：photosensitive resin
    

    環(huán)氧當(dāng)量：weight per epoxy equivalent (WPE)
    

    環(huán)氧值：epoxy value
    

    雙氰胺：dicyandiamide
    

    粘結(jié)劑：binder
    

    膠粘劑：adhesive
    

    固化劑：curing agent
    

    阻燃劑：flame retardant
    

    遮光劑：opaque
    

    增塑劑：plasticizers
    

    不飽和聚酯：unsatuiated polyester
    

    聚酯薄膜：polyester
    

    聚酰亞胺薄膜：polyimide film (PI)
    

    聚四氟乙烯：polytetrafluoetylene (PTFE)
    

    聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)
    

    增強(qiáng)材料：reinforcing material
    

    玻璃纖維：glass fiber
    

    E玻璃纖維：E-glass fibre
    

    D玻璃纖維：D-glass fibre
    

    S玻璃纖維：S-glass fibre
    

    玻璃布：glass fabric
    

    非織布：non-woven fabric
    

    玻璃纖維墊：glass mats
    

    紗線：yarn
    

    單絲：filament
    

    絞股：strand
    

    緯紗：weft yarn
    

    經(jīng)紗：warp yarn
    

    但尼爾：denier
    

    經(jīng)向：warp-wise
    

    緯向：weft-wise, filling-wise
    

    織物經(jīng)緯密度：thread count
    

    織物組織：weave structure
    

    平紋組織：plain structure
    

    壞布：grey fabric
    

    稀松織物：woven scrim
    

    弓緯：bow of weave
    

    斷經(jīng)：end missing
    

    缺緯：mis-picks
    

    緯斜：bias
    

    折痕：crease
    

    云織：waviness
    

    魚眼：fish eye
    

    毛圈長：feather length
    

    厚薄段：mark
    

    裂縫：split
    

    捻度：twist of yarn
    

    浸潤劑含量：size content
    

    浸潤劑殘留量：size residue
    

    處理劑含量：finish level
    

    浸潤劑：size
    

    偶聯(lián)劑：coupling agent
    

    處理織物：finished fabric
    

    聚酰胺纖維：polyamide fiber
    

    聚酯纖維非織布：non-woven polyester fabric
    

    浸漬絕緣縱紙：impregnating insulation paper
    

    聚芳酰胺纖維紙：aromatic polyamide paper
    

    斷裂長：breaking length
    

    吸水高度：height of capillary rise
    

    濕強(qiáng)度保留率：wet strength retention
    

    白度：whiteness
    

    陶瓷：ceramics
    

    導(dǎo)電箔：conductive foil
    

    銅箔：copper foil
    

    電解銅箔：electrodeposited copper foil (ED copper foil)
    

    壓延銅箔：rolled copper foil
    

    退火銅箔：annealed copper foil
    

    壓延退火銅箔：rolled annealed copper foil (RA copper foil)
    

    薄銅箔：thin copper foil
    

    涂膠銅箔：adhesive coated foil
    

    涂膠脂銅箔：resin coated copper foil (RCC)
    

    復(fù)合金屬箔：composite metallic material
    

    載體箔：carrier foil
    

    殷瓦：invar
    

    箔（剖面）輪廓：foil profile
    

    光面：shiny side
    

    粗糙面：matte side
    

    處理面：treated side
    

    防銹處理：stain proofing
    

    雙面處理銅箔：double treated foil
    

    設(shè)計
    

    原理圖：schematic diagram
    

    邏輯圖：logic diagram
    

    印制線路布設(shè)：printed wire layout
    

    布設(shè)總圖：master drawing
    

    可制造性設(shè)計：design-for-manufacturability
    

    計算機(jī)輔助設(shè)計：computer-aided design.(CAD)
    

    計算機(jī)輔助制造：computer-aided manufacturing.(CAM)
    

    計算機(jī)集成制造：computer integrate manufacturing.(CIM)
    

    計算機(jī)輔助工程：computer-aided engineering.(CAE)
    

    計算機(jī)輔助測試：computer-aided test.(CAT)
    

    電子設(shè)計自動化：electric design automation .(EDA)
    

    工程設(shè)計自動化：engineering design automaton .(EDA2)
    

    組裝設(shè)計自動化：assembly aided architectural design. (AAAD)
    

    計算機(jī)輔助制圖：computer aided drawing
    

    計算機(jī)控制顯示：computer controlled display .(CCD)
    

    布局：placement
    

    布線：routing
    

    布圖設(shè)計：layout
    

    重布：rerouting
    

    模擬：simulation
    

    邏輯模擬：logic simulation
    

    電路模擬：circuit simulation
    

    時序模擬：timing simulation
    

    模塊化：modularization
    

    布線完成率：layout efficiency
    

    機(jī)器描述格式：machine description format .(MDF)
    

    機(jī)器描述格式數(shù)據(jù)庫：MDF database
    

    設(shè)計數(shù)據(jù)庫：design database
    

    設(shè)計原點：design origin
    

    優(yōu)化（設(shè)計）：optimization (design)
    

    供設(shè)計優(yōu)化坐標(biāo)軸：predominant axis
    

    表格原點：table origin
    

    鏡像：mirroring
    

    驅(qū)動文件：drive file
    

    中間文件：intermediate file
    

    制造文件：manufacturing documentation
    

    隊列支撐數(shù)據(jù)庫：queue support database
    

    元件安置：component positioning
    

    圖形顯示：graphics display
    

    比例因子：scaling factor
    

    掃描填充：scan filling
    

    矩形填充：rectangle filling
    

    填充域：region filling
    

    實體設(shè)計：physical design
    

    邏輯設(shè)計：logic design
    

    邏輯電路：logic circuit
    

    層次設(shè)計：hierarchical design
    

    自頂向下設(shè)計：top-down design
    

    自底向上設(shè)計：bottom-up design
    

    線網(wǎng)：net
    

    數(shù)字化：digitizing
    

    設(shè)計規(guī)則檢查：design rule checking
    

    走（布）線器：router (CAD)
    

    網(wǎng)絡(luò)表：net list
    

    計算機(jī)輔助電路分析：computer-aided circuit analysis
    

    子線網(wǎng)：subnet
    

    目標(biāo)函數(shù)：objective function
    

    設(shè)計后處理：post design processing (PDP)
    

    交互式制圖設(shè)計：interactive drawing design
    

    費用矩陣：cost matrix
    

    工程圖：engineering drawing
    

    方塊框圖：block diagram
    

    迷宮：maze
    

    元件密度：component density
    

    巡回售貨員問題：traveling salesman problem
    

    自由度：degrees freedom
    

    入度：out going degree
    

    出度：incoming degree
    

    曼哈頓距離：Manhattan distance
    

    歐幾里德距離：Euclidean distance
    

    網(wǎng)絡(luò)：network
    

    陣列：array
    

    段：segment
    

    邏輯：logic
    

    邏輯設(shè)計自動化：logic design automation
    

    分線：separated time
    

    分層：separated layer
    

    定順序：definite sequence
    

    形狀與尺寸：
    

    導(dǎo)線（通道）：conduction (track)
    

    導(dǎo)線（體）寬度：conductor width
    

    導(dǎo)線距離：conductor spacing
    

    導(dǎo)線層：conductor layer
    

    導(dǎo)線寬度/間距：conductor line/space
    

    第一導(dǎo)線層：conductor layer No.1
    

    圓形盤：round pad
    

    方形盤：square pad
    

    菱形盤：diamond pad
    

    長方形焊盤：oblong pad
    

    子彈形盤：bullet pad
    

    淚滴盤：teardrop pad
    

    雪人盤：snowman pad
    

    V形盤：V-shaped pad
    

    環(huán)形盤：annular pad
    

    非圓形盤：non-circular pad
    

    隔離盤：isolation pad
    

    非功能連接盤：nonfunctional pad
    

    偏置連接盤：offset land
    

    腹（背）裸盤：back-bard land
    

    盤址：anchoring spaur
    

    連接盤圖形：land pattern
    

    連接盤網(wǎng)格陣列：land grid array
    

    孔環(huán)：annular ring
    

    元件孔：component hole
    

    安裝孔：mounting hole
    

    支撐孔：supported hole
    

    非支撐孔：unsupported hole
    

    導(dǎo)通孔：via
    

    鍍通孔：plated through hole (PTH)
    

    余隙孔：access hole
    

    盲孔：blind via (hole)
    

    埋孔：buried via hole
    

    埋/盲孔：buried /blind via
    

    任意層內(nèi)部導(dǎo)通孔：any layer inner via hole (ALIVH)
    

    全部鉆孔：all drilled hole
    

    定位孔：toaling hole
    

    無連接盤孔：landless hole
    

    中間孔：interstitial hole
    

    無連接盤導(dǎo)通孔：landless via hole
    

    引導(dǎo)孔：pilot hole
    

    端接全隙孔：terminal clearomee hole
    

    準(zhǔn)表面間鍍覆孔：quasi-interfacing plated-through hole
    

    準(zhǔn)尺寸孔：dimensioned hole
    

    在連接盤中導(dǎo)通孔：via-in-pad
    

    孔位：hole location
    

    孔密度：hole density
    

    孔圖：hole pattern
    

    鉆孔圖：drill drawing
    

    裝配圖：assembly drawing
    

    印制板組裝圖：printed board assembly drawing
    

    參考基準(zhǔn)：datum reference
    

     
    
                  
                  
                
    
            
    
        
    
        
      
        
    
    
   
   
    
    

  

    
   

    


    
	
    
        
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